Fin assembly

ABSTRACT

A fin assembly includes multiple first fins, multiple second fins and a heat pipe. An interval is formed between every two of the first fins which are neighboring to each other. The first fins and the second fins are alternately arranged with each other. The heat pipe penetrates through the plurality of first fins and the plurality of second fins. A partial volume of each second fin is disposed inside each interval, respectively.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a)on Patent Application No(s). 201410707443.4 filed in China on Nov. 27,2014, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION TECHNICAL FIELD OF THE INVENTION

The disclosure relates to a fin assembly. More particularly, thedisclosure relates to a fin assembly with multiple first fins andmultiple second fins that are alternatively arranged, and a part of eachsecond is between two of the first fins neighboring to each other.

DESCRIPTION OF THE RELATED ART

Since a new design concept has been established to make an electronicdevice become smaller in size and lighter in weight, electroniccomponents inside the electronic device have developed to beminiaturized accordingly. However, since the electronic components areminiaturized, the electronic components are too crowded inside theelectronic device. Namely, gaps between the electronic components arenarrowed. Hence, heat generated by the electronic components is hard tobe dissipated outside efficiently through the gaps.

The electronic device works unsteadily and ineffectively and the lifespans of the electronic components are shortened at a high temperature.Because of that, the electronic device is usually equipped with a heatdissipation device. In recent years, the heat dissipation device isformed by fins and a heat pipe, to dissipate the heat generated by theelectronic components. For example, each fin has a through hole, theheat pipe penetrates the through hole of each fin and is welded to thefins with a heat conduction medium (such as a solder paste).

However, it is difficult to control the amount of the solder paste. Whentoo much solder paste is pasted on the heat pipe and the through holes,the solder paste will overflow. Accordingly, the appearance of the heatdissipation device is affected, and the heat dissipation efficiency ofthe heat dissipation device may be reduced. Conversely, when littlesolder paste is pasted on the heat pipe and the through holes, the heatpipe cannot be fixed to the fins tightly, such that the heat dissipationefficiency of the heat dissipation device will be reduced. Moreover, toimprove the efficiency of heat dissipation of the heat dissipationdevice, an interval between every two of the fins is increased. Thus,solder balls are easily formed by the solder paste and further make theelectronic components (such as printed circuit board) short-circuited.Consequently, the appearance and the efficiency of heat dissipation ofthe heat dissipation device is also affected.

Hence, in order to improve the heat dissipation efficiency of the heatdissipation device, a new heat dissipation device needs to be developed.

SUMMARY OF THE INVENTION

One aspect of the disclosure provides a fin assembly which comprises aplurality of first fins, a plurality of second fins and a heat pipe. Aninterval is formed between every two of the plurality of first finswhich are neighboring to each other. The plurality of first fins and theplurality of second fins are alternately arranged with each other. Theheat pipe penetrates through the plurality of first fins and theplurality of second fins. A partial volume of each second fin isdisposed inside each interval, respectively.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description given hereinbelow and the accompanying drawingswhich are given by way of illustration only and thus are not limitativeof the present disclosure and wherein:

FIG. 1 is a perspective view of a fin assembly according to a firstembodiment of the disclosure;

FIG. 2 is an exploded view of the fin assembly in FIG. 1;

FIG. 3 is a top view of the fin assembly in FIG. 1;

FIG. 4A is a front view of a first fin according to the first embodimentof the disclosure;

FIG. 4B is a front view of a second fin according to the firstembodiment of the disclosure;

FIG. 5A is a front view of a first fin according to a second embodimentof the disclosure;

FIG. 5B is a front view of a second fin according to the secondembodiment of the disclosure;

FIG. 6A is a front view of a first fin according to a third embodimentof the disclosure;

FIG. 6B is a front view of a second fin according to the thirdembodiment of the disclosure;

FIG. 7A is a front view of a first fin according to a fourth embodimentof the disclosure; and

FIG. 7B is a front view of a second fin according to the fourthembodiment of the disclosure.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed embodiments. It will be apparent,however, that one or more embodiments may be practiced without thesespecific details. In other instances, well-known structures and devicesare schematically shown in order to simplify the drawings.

Please refer to FIG. 1 through FIG. 4B. FIG. 1 is a perspective view ofa fin assembly according to a first embodiment of the disclosure. FIG. 2is an exploded view of the fin assembly in FIG. 1. FIG. 3 is a top viewof the fin assembly in FIG. 1. FIG. 4A is a front view of a first finaccording to the first embodiment of the disclosure. FIG. 4B is a frontview of a second fin according to the first embodiment of thedisclosure. In this embodiment, the fin assembly 1 comprises a pluralityof first fins 11, a plurality of second fins 12, a heat pipe 13 and asolder 14.

As shown in FIG. 4A, each first fin 11 has a first surface 111 and afirst through hole 112. An interval 113 is formed between every two ofthe first fins 11 which are neighboring to each other. Additionally, thefirst fins are arranged as being equidistant from one another. In thisembodiment, each first fin 11 is a rectangular plate, and each firstthrough hole 112 is a cylinder through hole. Each first through hole 112is located away from a center C1 of each first fin 11. However, thedisclosure is not limited to the shapes of the first fins 11 and thepositions of the first through holes 112.

As shown in FIG. 4B, each second fin 12 has a second surface 121 and asecond through hole 122. The second fins are arranged as beingequidistant from one another. Moreover, the first fins 11 and the secondfins 12 are alternately arranged with each other. In this embodiment,each second fin 12 is also a rectangular plate, and each second throughhole 122 is also a cylinder through hole. Each second through hole 122is located away from a center C2 of each second fin 12. However, thedisclosure is not limited to the shapes of the second fins 12 and thepositions of the first through holes 112.

Furthermore, a partial volume of each second fin 12 is disposed insideeach interval 113, respectively. Accordingly, a projection area (notshown in FIGs.) is formed inside the interval 113 by projecting eachfirst surface 111 of each first fin 11 on each second surface 121 ofeach second fin 12, and an area ratio of the projection area to an areaof each second surface 121 is between 1% and 30%. For example, both theareas of each second surface 121 of each second fin 12 and an area ofeach first surface 111 of each first fin 11 are A1, and both thicknessesof each second fin 12 and each first fin 11 are T1. When 25 percent ofsecond fin 12 (that is, 0.25×A1 ×T1) is located inside each interval113, the area of each projection area is 25 percent of the area of thesecond surface 121 (that is, 0.25×A1).

The heat pipe 13 has an external surface 131, and the heat pipe 13penetrates through the first through holes 112 of the first fins 11 andthe second through holes 122 of the second fins 12. The external surface131 of the heat pipe 13 has a plurality of first connecting parts 132and a plurality of second connecting parts 133. The first fins 11 andthe second fins 12 are assembled with the heat pipe 13 over the firstconnecting parts 132 and the second connecting parts 133, respectively.In this embodiment, the first connecting parts 132 and the secondconnecting parts 133 are, but not limited to, ring-shaped.

The solder 14 continuously covers a section of the heat pipe 13 insideeach interval 113, for fixing the first fins 11 and the second fins 12to the heat pipe 13 steadily.

The disclosure is not limited to the shapes of the first fins 11 and thesecond fins 12, and the positions of the first through holes 112 and thesecond through holes 122 mentioned above. The following describesanother embodiment of the disclosure. Please refer to FIG. 5A and FIG.5B, FIG. 5A is a front view of a first fin according to a secondembodiment of the disclosure and FIG. 5B is a front view of a second finaccording to the second embodiment of the disclosure.

As shown in FIG. 5A, each first fin 21 has a first surface 211 and afirst through hole 212. An interval (not shown in FIGs.) is formedbetween every two of the first fins 21 which are neighboring to eachother. In this embodiment, each first fin 21 is a rectangular plate, andeach first through hole 212 is a cylinder through hole. Different fromthe first embodiment, each first through hole 212 is located at a centerC3 of each first fin 21 in this embodiment.

As shown in FIG. 5B, each second fin 22 has a second surface 221 and asecond through hole 222. In this embodiment, each second fin 22 is alsoa rectangular plate, and each second through hole 222 is also a cylinderthrough hole. Different from the first embodiment, each second throughhole 222 is located at a center C4 of each second fin 22, and a surfacearea of each first fin 21 is less than a surface area of each second fin22 in this embodiment.

Similar to the first embodiment, in this embodiment, a projection area(not shown in FIGs.) is formed inside the interval (not shown in FIGs.)by projecting each first surface 211 of each first fin 21 on each secondsurface 221 of each second fin 22, and an area ratio of the projectionarea to an area of each second surface 221 is also between 1% and 30%.

Except the first fins 21 and the second fins 22, other components, whichare not mentioned in this embodiment, are similar to the firstembodiment (please refer to FIG. 1 through FIG. 4B), such that they willnot be repeated again.

Moreover, please refer to FIG. 6A and FIG. 6B. FIG. 6A is a front viewof a first fin according to a third embodiment of the disclosure. FIG.6B is a front view of a second fin according to the third embodiment ofthe disclosure.

Different from the first embodiment, in this embodiment, each first fin31 comprises a first rectangular plate 311, a second rectangular plate312 and a first through hole 313 (as shown in FIG. 6A). In one of thefirst fins 31, the first rectangular plate 311 is connected to thesecond rectangular plate 312. The first through hole 313 is located at aconnection between the first rectangular plate 311 and the secondrectangular plate 312. The connection between the first rectangularplate 311 and the second rectangular plate 312 is away from a center ofthe first fin 31. In other words, The connection between the firstrectangular plate 311 and the second rectangular plate 312 is notlocated within the center of the first fin 31.

Additionally, in this embodiment, each second fin 32 comprises a thirdrectangular plate 321, a fourth rectangular plate 322 and a secondthrough hole 313 (as shown in FIG. 6B). In one of the second fins 32,the third rectangular plate 321 is connected to the fourth rectangularplate 322. The second through hole 323 is located at a connectionbetween the third rectangular plate 321 and the fourth rectangular plate322. The connection between the third rectangular plate 321 and thefourth rectangular plate 322 is away from a center of each second fin32.

Except the first fins 31 and the second fins 32, other components, whichare not mentioned in this embodiment, are similar to the firstembodiment (please refer to FIG. 1 through FIG. 4B), such that they willnot be repeated again.

Furthermore, please refer to FIG. 7A and FIG. 7B. FIG. 7A is a frontview of a first fin according to a fourth embodiment of the disclosure.FIG. 7B is a front view of a second fin according to the fourthembodiment of the disclosure.

Different from the first embodiment, in this embodiment, each first fin41 comprises a first triangular plate 411, a second triangular plate 412and a first through hole 413 (as shown in FIG. 7A). In one of the firstfins 41, the first triangular plate 411 is connected to the secondtriangular plate 412. The first through hole 413 is located at aconnection between the first triangular plate 411 and the secondtriangular plate 412. The connection between the first triangular plate411 and the second triangular plate 412 is away from a center of eachfirst fin 41.

Moreover, in this embodiment, each second fin 42 comprises a thirdtriangular plate 421, a fourth triangular plate 422 and a second throughhole 423 (as shown in FIG. 7B). In one of the second fins 42, the thirdtriangular plate 421 is connected to the fourth triangular plate 422.The second through hole 423 is located at a connection between the thirdtriangular plate 421 and the fourth triangular plate 422. The connectionbetween the third triangular plate 421 and the fourth triangular plate422 is far away from a center of the second fin 42.

Except the first fins 41 and the second fins 42, other components, whichare not mentioned in this embodiment, are similar to the firstembodiment (please refer to FIG. 1 through FIG. 4B), such that they willnot be repeated again.

To sum up, a heat dissipation device in the prior art is formed by finsand a heat pipe to dissipate the heats generated by electroniccomponents. However, it is difficult to control the amount of the solderpaste. When too much solder paste is pasted on the heat pipe and thethrough holes, the solder paste will overflow. Accordingly, theappearance of the heat dissipation device will be affected, and the heatdissipation efficiency of the heat dissipation device will be reduced.According to the embodiments of the disclosure, since the fin assemblycomprises the plurality of first fins and the plurality of second fins,and the partial volume of the second fins are disposed inside theintervals, respectively. When the first fins and the second fins arewelded to the heat pipe with the solder, a solder ball is not formed atthe same time. Accordingly, the appearance and the heat dissipationefficiency of the fin assembly are improved.

The disclosure will become more fully understood from the saidembodiment for illustration only and thus does not limit the disclosure.Any modifications within the spirit and category of the disclosure fallin the scope of the disclosure.

What is claimed is:
 1. A fin assembly, comprising: a plurality of firstfins, an interval being formed between every two of the plurality offirst fins which are neighboring to each other; a plurality of secondfins, the plurality of first fins and the plurality of second fins beingalternately arranged with each other; and a heat pipe penetratingthrough the plurality of first fins and the plurality of second fins;wherein a partial volume of each second fin is disposed inside eachinterval, respectively.
 2. The fin assembly according to claim 1,wherein the plurality of first fins are arranged as being equidistantfrom one another, and the plurality of second fins are arranged as beingequidistant from one another.
 3. The fin assembly according to claim 1,wherein each first fin comprises a first surface, each second fincomprises a second surface, a projection area is formed inside theinterval by projecting each first surface on each second surface, and anarea ratio of the projection area to an area of the second surface isbetween 1% and 50%.
 4. The fin assembly according to claim 3, whereinthe area ratio of the projection area to the area of the second surfaceis between 1% and 30%.
 5. The fin assembly according to claim 1, whereineach first fin comprises a first through hole, each second fin comprisesa second through hole, and the heat pipe penetrates through each firstthrough hole of each first fin and each second through hole of eachsecond fin, respectively.
 6. The fin assembly according to claim 5,wherein each first fin and each second fin are rectangular plates, eachfirst through hole is located at a center of each first fin, and eachsecond through hole is located at a center of each second fin.
 7. Thefin assembly according to claim 5, wherein each first fin and eachsecond fin are rectangular plates, each first through hole is locatedfar away from a center of each first fin, and each second through holeis located far away from a center of each second fin.
 8. The finassembly according to claim 7, wherein each first fin comprises a firstrectangular plate and a second rectangular plate which are connected toeach other, each second fin comprises a third rectangular plate and afourth rectangular plate which are connected to each other, the firstthrough hole is located at a connection between the first rectangularplate and the second rectangular plate, and the second through hole islocated at a connection between the third rectangular plate and thefourth rectangular plate.
 9. The fin assembly according to claim 7,wherein each first fin comprises a first triangular plate and a secondtriangular plate which are connected to each other, each second fincomprises a third triangular plate and a fourth triangular plate whichare connected to each other, the first through hole is located at aconnection between the first triangular plate and the second triangularplate, and the second through hole is located at a connection betweenthe third triangular plate and the fourth triangular plate.
 10. The finassembly according to claim 1, further comprising a solder continuouslycovering a section of the heat pipe inside the interval.